New Material Reduces Data Center Energy

This is a news story, published by ScienceAlert, that relates primarily to TIM news.

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ScienceAlert

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New Thermal Material Could Slash Data Center Cooling Demands

Summary

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89% Informative

A new material could significantly improve cooling of our data centers and make electronics more energy efficient.

The organic thermal interface material ( TIM ) boosts the rate at which heat can be taken away from active electronic components and channeled into a heatsink for air or water to carry away.

The next step is to get the material working on larger systems and in a wider variety of scenarios.

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