3D Integration Enhances Dense Circuits

This is a news story, published by TechXplore, that relates primarily to Pennsylvania State University news.

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3D integration approach

TechXplore

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Creating compact near-sensor computing chips via 3D integration of 2D materials

Summary

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92% Informative

Researchers at Pennsylvania State University developed highly compact near-sensor computing chips via the heterogeneous M3D integration of two -dimensional (2D) materials.

The chip they created integrates over 500 chemitransistors and over 500 memtransistors, with vertical interconnects (vias) that are 3 m in size and at a 1 m distance from each other.

VR Score

Informative language

Neutral language

Article tone

semi-formal

Language

English

Language complexity

Offensive language

not offensive

Hate speech

not hateful