This is a news story, published by TechXplore, that relates primarily to Pennsylvania State University news.
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3D integration approachTechXplore
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92% Informative
Researchers at Pennsylvania State University developed highly compact near-sensor computing chips via the heterogeneous M3D integration of two -dimensional (2D) materials.
The chip they created integrates over 500 chemitransistors and over 500 memtransistors, with vertical interconnects (vias) that are 3 m in size and at a 1 m distance from each other.
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