Laser Aligns 3D Chip Holograms

This is a news story, published by TechXplore, that relates primarily to the University of Massachusetts Amherst news.

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3D semiconductor chips

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2D semiconductor chips

TechXplore

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Ultraprecise method of aligning 3D semiconductor chips invented

Summary

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91% Informative

Researchers at the University of Massachusetts Amherst invented a new way to align 3D semiconductor chips by shining a laser through concentric metalenses patterned on the chips to produce a hologram.

Their work can help to lower the cost of producing 2D semiconductors, enable 3D photonic and electronic chips, and may pave the way for other low-cost, compact sensors.

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Neutral language

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informal

Language

English

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not offensive

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not hateful