CHIPS Funds Advanced Semiconductor Packaging
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Semiconductor packagingNIST
•Biden-Harris Administration Opens Funding Competition for Up to $1.6 Billion to Accelerate U.S. Semiconductor Advanced Packaging Technologies
81% Informative
Semiconductor packaging allows multiple components to be brought together as a single electronic device.
Advanced packaging brings those components together in novel ways that improves performance of chips while reducing cost and power consumption.
CHIPS for America anticipates making available up to approximately $1.6 billion in funding across multiple awards of varying size and scope.
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