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Semiconductor packagingNIST
•81% Informative
Semiconductor packaging allows multiple components to be brought together as a single electronic device.
Advanced packaging brings those components together in novel ways that improves performance of chips while reducing cost and power consumption.
CHIPS for America anticipates making available up to approximately $1.6 billion in funding across multiple awards of varying size and scope.
VR Score
88
Informative language
93
Neutral language
61
Article tone
formal
Language
English
Language complexity
93
Offensive language
not offensive
Hate speech
not hateful
Attention-grabbing headline
not detected
Known propaganda techniques
not detected
Time-value
short-lived
External references
no external sources
Source diversity
no sources
Affiliate links
no affiliate links