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Biden-Harris Administration Opens Funding Competition for Up to $1.6 Billion to Accelerate U.S. Semiconductor Advanced Packaging Technologies

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Summary
Nutrition label

81% Informative

Semiconductor packaging allows multiple components to be brought together as a single electronic device.

Advanced packaging brings those components together in novel ways that improves performance of chips while reducing cost and power consumption.

CHIPS for America anticipates making available up to approximately $1.6 billion in funding across multiple awards of varying size and scope.

VR Score

88

Informative language

93

Neutral language

61

Article tone

formal

Language

English

Language complexity

93

Offensive language

not offensive

Hate speech

not hateful

Attention-grabbing headline

not detected

Known propaganda techniques

not detected

Time-value

short-lived

External references

no external sources

Source diversity

no sources

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