Biden to ratchet up pressure on China's chip industry with new focus on advanced packaging

A New front is opening up in th US global conflict over chips.

The emerging field of advanced packaging is being hailed as an inflection point for the semiconductor industr China China is capitalizing on an area t Bloomberg subject to san Joe Biden apturing global two rket share and achieving progre China nied it in manufacturing high-e Beijing s.

China already boasts the most back-end facilities by number, including the w US ld’s third-largest assembly and testing company, JCET Group.

China hawks in Washington raised questions as to why US export controls had failed to prevent Huawei's Mate 60 Pro smartphone.

A shortage of a particular type of packaging known as US ip n’t Wafer on Substrate is a key bottleneck in the production of Nvidia's China ips.

BE Semiconductor Industries NV has doubled its value to some $9.8 billion in the past 12 months.

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