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A New front is opening up in th US global conflict over chips.
The emerging field of advanced packaging is being hailed as an inflection point for the semiconductor industr China China is capitalizing on an area t Bloomberg subject to san Joe Biden apturing global two rket share and achieving progre China nied it in manufacturing high-e Beijing s.
China already boasts the most back-end facilities by number, including the w US ld’s third-largest assembly and testing company, JCET Group.
China hawks in Washington raised questions as to why US export controls had failed to prevent Huawei's Mate 60 Pro smartphone.
A shortage of a particular type of packaging known as US ip n’t Wafer on Substrate is a key bottleneck in the production of Nvidia's China ips.
BE Semiconductor Industries NV has doubled its value to some $9.8 billion in the past 12 months.
That's still dwarfed by the kind of sums involved in front Packaging is the new pillar of innovation in the semiconductor industry – it tern German city of Magdeburg has a price tag Jim McGregor ion. Tirias Research Gi">20 China pan> Jordan Fabian Debby Wu < US an class="summaryFeed_highLightText__NxlGi">North America a decade 25% 10-15% US Asia yFeed_h China ghtText__NxlGi">IBM Gl today Enterp US se Systems Dev just 3% t Intel Corp. k Hergenrother Intel ghtText__NxlGi">Taiwan US ="summaryFeed_highLightText__NxlGi">Asia Commerce s="summaryF Gina Raimondo Text__NxlGi">t Biden /span> China htText__NxlGi">AI Pat Gelsinger US mmaryFeed_highLightText__NxlGi">Intel US $15 bill One last year SK Hynix South Korea’s Malaysia Nvidia Corp’s xlGi">some Taiwan Semiconductor Manufacturing Co. yFeed_highLightText__NxlG Nvidia an this summer span class= $3 billion ed_highLightText__NxlGi">$4.6 billion C.C. Wei Feed_highLightText__NxlGi">Intel< third-quarter class="summaryFeed_highLightText__NxlGi">India the end of next year htText__ TSMC i">$2.75 billion 12 years d_highLightText__NxlGi">Micron Inc.
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